Systems-Level Packaging for Millimeter-Wave Transceivers

Systems-Level Packaging for Millimeter-Wave Transceivers
Author: Mladen Božanić
Publisher: Springer
Total Pages: 277
Release: 2019-03-26
Genre: Technology & Engineering
ISBN: 3030146901
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This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

Millimeter-Wave Integrated Circuits

Millimeter-Wave Integrated Circuits
Author: Mladen Božanić
Publisher: Springer Nature
Total Pages: 259
Release: 2020-03-16
Genre: Technology & Engineering
ISBN: 3030443981
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This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.

Millimeter-wave Integrated Technologies in the Era of the Fourth Industrial Revolution

Millimeter-wave Integrated Technologies in the Era of the Fourth Industrial Revolution
Author: Wynand Lambrechts
Publisher: Springer Nature
Total Pages: 284
Release: 2020-06-20
Genre: Technology & Engineering
ISBN: 3030504727
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This peer-reviewed book explores the technologies driving broadband internet connectivity in the fourth industrial revolution (Industry 4.0). It particularly focuses on potential solutions to introduce these technologies in emerging markets and rural areas, regions that typically form part of the digital divide and often have under-developed telecommunications infrastructures, a lack of skilled workers, and geographical restrictions that limit broadband connectivity. Research shows that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, with the common goal of bringing positive change to the lives of individuals. Fifth-generation (5G) networks based on millimeter-wave (mm-wave) frequency information transfer have the potential to provide future-proof, affordable and sustainable broadband connectivity in areas where previous-generation mobile networks were unable to do so. This book discusses the principles of various technologies that enable electronic circuits to operate at mm-wave frequencies. It examines the importance of identifying, describing, and analyzing technology from a purely technological standpoint, but also acknowledges and investigates the challenges and limitations of introducing such technologies in emerging markets. Presenting recent research, the book spearheads participation in Industry 4.0 in these areas.

Mobile Communication Networks: 5G and a Vision of 6G

Mobile Communication Networks: 5G and a Vision of 6G
Author: Mladen Božanić
Publisher: Springer Nature
Total Pages: 335
Release: 2021-02-15
Genre: Technology & Engineering
ISBN: 3030692736
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This book contributes to the body of scholarly knowledge by exploring the main ideas of wireless networks of past, present, and future, trends in the field of networking, the capabilities of 5G and technologies that are potential enablers of 6G, potential 6G applications and requirements, as well as unique challenges and opportunities that 6G research is going to offer over the next decade. It covers research topics such as communication via millimeter-waves, terahertz waves and visible light to enable faster speeds, as well as research into achieving other basic requirements of 6G networks. These include low end-to-end latency, high energy efficiency, coverage that is ubiquitous and always-on, integration of terrestrial wireless with non-terrestrial networks, network management that is made more effective by connected intelligence with machine learning capabilities, as well as support for the evolution of old service classes and support for new ones.

Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems

Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems
Author: Zhi Ning Chen
Publisher: John Wiley & Sons
Total Pages: 322
Release: 2021-04-29
Genre: Technology & Engineering
ISBN: 1119611156
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Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems The first and only comprehensive text on substrate-integrated mmW antenna technology, state-of-the-art antenna design, and emerging wireless applications Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems elaborates the most important topics related to revolutionary millimeter-wave (mmW) technology. Following a clear description of fundamental concepts including substrate-integrated waveguides and loss analysis, the text treats key design methods, prototyping techniques, and experimental setup and testing. The authors also highlight applications of mmW antennas in 5G wireless communication and next-generation radar systems. Readers are prepared to put techniques into practice through practical discussions of how to set up testing for impedance matching, radiation patterns, gain from 24GHz up to 325 GHz, and more. This book will bring readers state-of-the-art designs and recent progress in substrate-integrated mmW antennas for emerging wireless applications. Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems is the first comprehensive text on the topic, allowing readers to quickly master mmW technology. This book: Introduces basic concepts such as metamaterials Huygens's surface, zero-index structures, and pattern synthesis Describes prototyping in the form of fabrication based on printed-circuit-board, low-temperature-co-fired-ceramic and micromachining Explores applications for next-generation radar and imaging systems such as 24-GHz and 77-GHz vehicular radar systems Elaborates design methods including waveguide-based feeding network, three-dimensional feeding structure, dielectric loaded aperture antenna element, and low-sidelobe synthesis The mmW is one of today’s most important emerging technologies. This book provides graduate students, researchers, and engineers with the knowledge they need to deploy mmW systems and develop new antenna designs with low cost, low loss, and low complexity.

Advanced Materials and Components for 5G and Beyond

Advanced Materials and Components for 5G and Beyond
Author: Colin Tong
Publisher: Springer Nature
Total Pages: 276
Release: 2022-11-16
Genre: Science
ISBN: 3031172078
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This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

Applications in Electronics Pervading Industry, Environment and Society

Applications in Electronics Pervading Industry, Environment and Society
Author: Francesco Bellotti
Publisher: Springer Nature
Total Pages: 523
Release: 2024-01-12
Genre: Technology & Engineering
ISBN: 3031481216
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This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2023 ApplePies Conference, held in Genoa, Italy, in September 2023, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.

Transceiver Technologies for Millimeter-Wave Beam Steering Applications (Band 71)

Transceiver Technologies for Millimeter-Wave Beam Steering Applications (Band 71)
Author: Yi-Fan Tsao
Publisher: Cuvillier Verlag
Total Pages: 147
Release: 2022-11-08
Genre: Technology & Engineering
ISBN: 3736967020
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During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.

Antenna-in-Package Technology and Applications

Antenna-in-Package Technology and Applications
Author: Duixian Liu
Publisher: John Wiley & Sons
Total Pages: 416
Release: 2020-03-31
Genre: Technology & Engineering
ISBN: 1119556635
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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.