Smart Power ICs

Smart Power ICs
Author: Bruno Murari
Publisher: Springer Science & Business Media
Total Pages: 598
Release: 2002-06-13
Genre: Design
ISBN: 9783540432388

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This book provides a survey of the state of the art of technology and future trends in the new family of Smart Power ICs and describes design and applications in a variety of fields ranging from automotive to telecommunications, reliability evaluation and qualification procedures. The book is a valuable source of information and reference for both power IC design specialists and to all those concerned with applications, the development of digital circuits and with system architecture.

Smart Power ICs

Smart Power ICs
Author: Bruno Murari
Publisher: Springer
Total Pages: 0
Release: 2002-06-27
Genre: Technology & Engineering
ISBN: 9783642613951

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This survey of the state of the art of technology and future trends in the new family of Smart Power ICs describes design and applications in a variety of fields, ranging from automotive to telecommunications, reliability evaluation and qualification procedures.

Smart Power Integration

Smart Power Integration
Author: Mohamed Abouelatta
Publisher: John Wiley & Sons
Total Pages: 324
Release: 2022-09-14
Genre: Technology & Engineering
ISBN: 139416954X

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Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.

Parasitic Substrate Coupling in High Voltage Integrated Circuits

Parasitic Substrate Coupling in High Voltage Integrated Circuits
Author: Pietro Buccella
Publisher: Springer
Total Pages: 195
Release: 2018-03-14
Genre: Technology & Engineering
ISBN: 3319743821

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This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.

Smart Power Integration

Smart Power Integration
Author: Mohamed Abouelatta
Publisher: John Wiley & Sons
Total Pages: 324
Release: 2022-10-18
Genre: Technology & Engineering
ISBN: 1786308371

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Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.

Lateral Power Transistors in Integrated Circuits

Lateral Power Transistors in Integrated Circuits
Author: Tobias Erlbacher
Publisher: Springer
Total Pages: 235
Release: 2014-10-08
Genre: Technology & Engineering
ISBN: 3319005006

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The book summarizes and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications. In its first part, the book motivates the necessity for lateral power transistors by a top-down approach: First, it presents typical energy conversion applications in modern industrial, automotive and consumer electronics. Next, it introduces common circuit topologies suitable for these applications, and discusses the feasibility for monolithic integration. Finally, the combination of power and logic functionality on a single chip is motivated and the requirements and limitations for the power semiconductor devices are deduced. The second part describes the evolution of lateral power transistors over the past decades from the simple pin-type concept to double-acting RESURF topologies. It describes the principle of operation for these LDMOS devices and discusses limitations of lateral power devices. Moreover, figures-of-merit are presented which can be used to evaluate the performance of the novel lateral power transistors described in this book with respect to the LDMOS devices. In the last part, [..] the fundamental physical concepts including charge compensation and trench gate topologies are discussed. Also, the status of research in LDMOS devices on silicon carbide is presented. Advantages and drawbacks for each of these integration approaches are summarized, and the feasibility with respect to power electronic applications is evaluated.

Technology of Integrated Circuits

Technology of Integrated Circuits
Author: D. Widmann
Publisher: Springer Science & Business Media
Total Pages: 355
Release: 2013-03-09
Genre: Technology & Engineering
ISBN: 366204160X

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This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.