Simulation, Modeling and Characterization of SiC Devices

Simulation, Modeling and Characterization of SiC Devices
Author: Liangchun Yu
Publisher:
Total Pages: 111
Release: 2010
Genre: Metal oxide semiconductor field-effect transistors
ISBN:
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With superior material properties, Silicon carbide (SiC) power devices show great potential for high-power density, high temperature switching applications. Among all the power device structures, SiC MOSFET attracts the most attention because of its high gate input impedance, simple gate control and fast switching speed. However, low inversion channel mobility, high near-interface state density close to the conduction band edge, questionable oxide reliability as well as theoretical limit on the device figure-of-merit still remain to be significant challenges to the development of SiC power MOSFETs. In this dissertation, all of the above challenges are addressed from various approaches. First, simulations on the super-junction structure show that the unipolar theoretical limit of SiC can be broken even with the state-of-the-art processing technologies. An easy-to-implement analytical model is developed for calculations of the blocking voltage, specific on-resistance and charge imbalance effects of 4H-SiC super-junction devices. This model is validated by extensive numerical simulations with a large variety of device parameters. Device design and optimization using this model are also presented. Second, a wafer-level Hall mobility measurement technique is developed to measure channel mobility more accurately, more efficiently and more cost-effectively. Device characterization and development are much more convenient by using this technique. With this method, further explorations of interactions between interface traps and channel carriers as well as device degradation mechanisms become possible. Third, reliability of SiO2 on 4H-SiC is characterized with time dependent dielectric breakdown (TDDB) measurements at various temperatures and electric fields. Lifetime prediction to normal operation conditions suggests that the oxide on SiC has a characteristic lifetime of 10 years at 375° C if the oxide electric field is kept below 4.6 MV/cm. The observed excellent reliability data contradict the widespread belief that the oxide on SiC is intrinsically limited by its physical properties. Detailed discussions are provided to re-examine the arguments leading to the misconception.

Characterization and Modeling of Sic Multi-Chip Power Modules

Characterization and Modeling of Sic Multi-Chip Power Modules
Author: Ryan Taylor
Publisher:
Total Pages: 0
Release: 2022
Genre: Electronic dissertations
ISBN:
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The accelerating commercialization of wide bandgap technology has led to increased demand for accurate circuit-level simulation models of devices such as Silicon-Carbide (SiC) MOSFET power modules. These models assist with optimizing systems to minimize overshoot and electromagnetic interference (EMI) associated with wide bandgap (WBG) switching conditions. As a result, capturing these behaviors requires more detailed and advanced modeling and characterization techniques than traditional Silicon (Si) semiconductors. These advancements include improvements to the parasitic package model, transistor characterization, and computational efficiency of the synthesized model. In this dissertation, a commercially available half-bridge SiC power module is characterized and modeled in SPICE. Simulation and empirical characterization techniques are used to quantify the packaging parasitics of the module. These parasitics include self-inductances, mutual coupling terms, and baseplate capacitances (BPC) that are sensitive to the high di/dt and dv/dt events that occur during switching transitions. The simulation predictions and empirical measurements are used to cross-validate each other and determine the preferred method for quantifying each parasitic parameter. The SiC transistors are characterized using a combination of commercial equipment and custom measurement techniques. The characterization process is described in detail and sensitivities are uncovered in that are crucial to the modeling effort. The characterization includes an advanced conduction analysis (ACA) system that combined with a self-heating removal algorithm is capable of quantifying the short-channel behavior of the device at high voltage. Finally, the package model and SiC MOSFET characteristics are used to synthesize a compact behavioral model. The model is evaluated in terms of its accuracy through comparison of quantitative error metrics across a wide range of double pulse test (DPT) operating conditions. The model is also evaluated in a multi-level inverter simulation to determine its computational efficiency and convergence behavior. It is shown that the model is highly accurate across the selected range of operating conditions and is capable of converging quickly in complex circuit topologies.

Modeling And Electrothermal Simulation Of Sic Power Devices: Using Silvaco© Atlas

Modeling And Electrothermal Simulation Of Sic Power Devices: Using Silvaco© Atlas
Author: Pushpakaran Bejoy N
Publisher: World Scientific
Total Pages: 464
Release: 2019-03-25
Genre: Technology & Engineering
ISBN: 9813237848
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The primary goal of this book is to provide a sound understanding of wide bandgap Silicon Carbide (SiC) power semiconductor device simulation using Silvaco© ATLAS Technology Computer Aided Design (TCAD) software. Physics-based TCAD modeling of SiC power devices can be extremely challenging due to the wide bandgap of the semiconductor material. The material presented in this book aims to shorten the learning curve required to start successful SiC device simulation by providing a detailed explanation of simulation code and the impact of various modeling and simulation parameters on the simulation results. Non-isothermal simulation to predict heat dissipation and lattice temperature rise in a SiC device structure under switching condition has been explained in detail. Key pointers including runtime error messages, code debugging, implications of using certain models and parameter values, and other factors beneficial to device simulation are provided based on the authors' experience while simulating SiC device structures. This book is useful for students, researchers, and semiconductor professionals working in the area of SiC semiconductor technology. Readers will be provided with the source code of several fully functional simulation programs that illustrate the use of Silvaco© ATLAS to simulate SiC power device structure, as well as supplementary material for download.

Characterization and Modeling of SiC Power MOSFETs

Characterization and Modeling of SiC Power MOSFETs
Author: Xiangxiang Fang
Publisher:
Total Pages: 63
Release: 2012
Genre:
ISBN:
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Based on the characterization results, two different modeling methods have been implemented for the SiC MOSFET. A double-pulse tester (DPT) was built to perform switching characteristics of SiC MOSFET at 100V drain bias, 10A load current level and the same DPT circuit has been implemented in Synopsys Saber to verify the device models previously built. By comparison of simulated static and dynamic characteristics to measurement data, both models we built have been verified. Good agreements were obtained between the device models and experimental results. Approaches to improve the models have been investigated and limitations of the model have been discussed.

Design, Characterization, Modeling and Analysis of High Voltage Silicon Carbide Power Devices

Design, Characterization, Modeling and Analysis of High Voltage Silicon Carbide Power Devices
Author:
Publisher:
Total Pages:
Release: 2001
Genre:
ISBN:
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This research focuses on the design, characterization, modeling and analysis of high voltage Silicon Carbide (SiC) metal-oxide-semiconductor field effect transistors (MOSFET), insulated gate bipolar transistors (IGBT) and emitter turn-off thyristors (ETO) to satisfy the stringent requirements of advanced power electronic systems. The loss information, frequency capability and switching ruggedness of these 10-kV SiC power devices are studied extensively in order to provide their application prospects in solid-state transformers (SST). Among 10-kV SiC power devices, SiC MOSFETs are of the greatest interest due to their lower specific on-resistance compared to silicon MOSFETs, and their inherently fast switching speed due to their majority carrier conduction mechanism. Therefore, 10-kV SiC MOSFETs are studied first in this dissertation. The characterization, modeling and analysis of 10-kV SiC MOSFETs were investigated extensively. The low losses and high switching frequency of 10-kV SiC MOSFETs were demonstrated in characterization study and a 4-kV 4 kW boost converter. The on-resistance of SiC MOSFETs increases rapidly with increased junction temperature and blocking voltage. This makes their conduction losses possibly unacceptable for applications where high DC supply voltages (more than 10-kV) and high temperature operation are used. This warrants the development of SiC bipolar devices (IGBTs and thyristors) to achieve smaller conduction losses due to the conductivity modulation of their thick drift layers, especially at elevated temperatures. Therefore, design, characterization and optimization of 10-kV SiC IGBT and ETO were dicussed. A 4H-SiC p-channel IGBT with improved conduction characteristics was developed and characterized experimentally as well as analyzed theoretically by numerical simulations. The device exhibited a differential on-resistance of 26 mOhm.cm^2 at a collector current density of 100 A/cm^2 at room temperature. An the SiC IGBT showed a turn-of.

Epitaxial Graphene on Silicon Carbide

Epitaxial Graphene on Silicon Carbide
Author: Gemma Rius
Publisher: CRC Press
Total Pages: 248
Release: 2018-01-19
Genre: Science
ISBN: 1351736221
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This is the first book dedicated exclusively to epitaxial graphene on silicon carbide (EG-SiC). It comprehensively addresses all fundamental aspects relevant for the study and technology development of EG materials and their applications, using quantum Hall effect studies and probe techniques such as scanning tunneling microscopy and atomic resolution imaging based on transmission electron microscopy. It presents the state of the art of the synthesis of EG-SiC and profusely explains it as a function of SiC substrate characteristics such as polytype, polarity, and wafer cut as well as the in situ and ex situ conditioning techniques, including H2 pre-deposition annealing and chemical mechanical polishing. It also describes growth studies, including the most popular characterization techniques, such as ultrahigh-vacuum, partial-pressure, or graphite-cap sublimation techniques, for high-quality controlled deposition. The book includes relevant examples on synthesis and characterization techniques as well as device fabrication processing and performance and complements them with theoretical modeling and simulation studies, which are helpful in the fundamental comprehension of EG-SiC substrates and their potential use in electronic applications. It addresses the fundamental aspects of EG-SiC using quantum Hall effect studies as well as probe techniques, such as scanning tunneling microscopy or atomic resolution imaging based on transmission electron microscopy. It comprises chapters that present reviews and vision on the current state of the art of experts in physics, electronic engineering, materials science, and nanotechnology from Europe and Asia.

MOSFET Modeling, Simulation and Parameter Extraction in 4H- 6H- Silicon Carbide

MOSFET Modeling, Simulation and Parameter Extraction in 4H- 6H- Silicon Carbide
Author:
Publisher:
Total Pages:
Release: 2005
Genre:
ISBN:
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This thesis presents the work on analytical modeling and simulation of a silicon carbide (SiC) power MOSFET, model verification with test data, and device characterization and parameter extraction of the SPICE model. The development of temperature models for a lateral as well as a vertical MOSFET in SiC are also presented. The model takes into account the various short channel effects in the DIMOS channel region as well as the velocity saturation effect in the drift region. Considering the SiC material processing limitations and feedback from the system level application group, an application specific SiC power MOSFET structure has been proposed. The device dimensions were chosen to obtain the desired specific on-resistance and breakdown voltage of the power MOSFET. A good agreement between the analytical model and the MEDICI simulation is demonstrated. The temperature models include effects of temperature on the threshold voltage, carrier mobility, the body leakage current, and the drain and source contact region resistances for a lateral MOSFET and the effects of temperature on the threshold voltage, carrier mobility, the body leakage current, drift region resistance and channel resistance for a vertical MOSFET. The temperature dependent compensating current elements are introduced in the model. These compensating currents contribute to the total current at high temperatures. A rigorous testing and characterization has been carried out on a 4H-SiC DIMOS transistor test device. SPICE parameters have been extracted from the measurements and a SPICE model for the DIMOS transistor has been developed. The models developed in this research will not only help the SiC device researchers in the device behavioral study but will also provide a SPICE model for circuit designers.

Fundamentals of Silicon Carbide Technology

Fundamentals of Silicon Carbide Technology
Author: Tsunenobu Kimoto
Publisher: John Wiley & Sons
Total Pages: 565
Release: 2014-11-24
Genre: Technology & Engineering
ISBN: 1118313526
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A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development. This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.

Simulation of Semiconductor Devices and Processes

Simulation of Semiconductor Devices and Processes
Author: Siegfried Selberherr
Publisher: Springer Science & Business Media
Total Pages: 525
Release: 2012-12-06
Genre: Computers
ISBN: 3709166578
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The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development.