MEMS Reliability

MEMS Reliability
Author: Allyson L. Hartzell
Publisher: Springer Science & Business Media
Total Pages: 300
Release: 2010-11-02
Genre: Technology & Engineering
ISBN: 144196018X

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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Reliability of MEMS

Reliability of MEMS
Author: Osamu Tabata
Publisher: John Wiley & Sons
Total Pages: 324
Release: 2014-07-21
Genre: Technology & Engineering
ISBN: 3527335013

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This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

Reliability of MEMS

Reliability of MEMS
Author: Osamu Tabata
Publisher: John Wiley & Sons
Total Pages: 325
Release: 2008-09-08
Genre: Technology & Engineering
ISBN: 352762256X

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This edition of 'Reliability of MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, one of the most important hurdles to commercialization for microelectromechanical systems is covered in detail: the reliability of MEMS materials and devices. Due to their microscale size combined with novel functionalities, a whole new category of challenges arises, and proper determination of a given device's reliability is instrumental in determining its range of usability and application fields. Any kind of gadget's performance, lifetime and safety will depend on the continued and predictable functioning of both the electronic as well as the micromechanical parts. MEMS reliability therefore can be as serious as human life-and-death matters - quite literally in the case of roll-over sensors for cars, for example.

Reliability of MEMS

Reliability of MEMS
Author: Osamu Tabata
Publisher: John Wiley & Sons
Total Pages: 328
Release: 2008-02-04
Genre: Technology & Engineering
ISBN: 9783527314942

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This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

MEMS Reliability for Critical and Space Applications

MEMS Reliability for Critical and Space Applications
Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
Total Pages: 190
Release: 1999
Genre: Technology & Engineering
ISBN:

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A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.

MEMS Reliability for Critical Applications

MEMS Reliability for Critical Applications
Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
Total Pages: 162
Release: 2000
Genre: Technology & Engineering
ISBN:

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An Introduction to Microelectromechanical Systems Engineering

An Introduction to Microelectromechanical Systems Engineering
Author: Nadim Maluf
Publisher: Artech House
Total Pages: 312
Release: 2004
Genre: Technology & Engineering
ISBN: 9781580535915

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Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.

MEMS Reliability

MEMS Reliability
Author:
Publisher:
Total Pages: 169
Release: 2000
Genre:
ISBN:

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The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

RF MEMS

RF MEMS
Author: Gabriel M. Rebeiz
Publisher: John Wiley & Sons
Total Pages: 512
Release: 2004-02-06
Genre: Technology & Engineering
ISBN: 0471462888

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Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

Advanced MEMS Packaging

Advanced MEMS Packaging
Author: John H. Lau
Publisher: McGraw Hill Professional
Total Pages: 577
Release: 2009-10-22
Genre: Technology & Engineering
ISBN: 0071627928

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A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging