Practical Thermal Design For Electronic Equipment
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| Author | : Ralph Remsburg |
| Publisher | : CRC Press |
| Total Pages | : 395 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 142004236X |
Download Thermal Design of Electronic Equipment Book in PDF, Epub and Kindle
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
| Author | : Sung Jin Kim |
| Publisher | : CRC Press |
| Total Pages | : 300 |
| Release | : 1998-01-01 |
| Genre | : |
| ISBN | : 9780849316890 |
Download Practical Thermal Design for Electronic Equipment Book in PDF, Epub and Kindle
Very Large Scale Integration (VLSI) technology has raised significant considerations of thermal control. This practical reference for thermal and design engineers addresses topics related to thermal cooling of electronic equipment. The text includes numerous examples and calculations from engineering applications and provides design guides for packaging and thermal engineers. It also examines the advancement of technologies in the electronic industry and addresses such questions as: what is the life expectancy of an air moving device?; how does one thermally characterize an electronic component?; how does one choose and optimize heat sink?; and what are the limitations of numerical simulation tools?
| Author | : Ralph Remsburg |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 618 |
| Release | : 2011-06-27 |
| Genre | : Technology & Engineering |
| ISBN | : 1441985093 |
Download Advanced Thermal Design of Electronic Equipment Book in PDF, Epub and Kindle
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
| Author | : Ralph Remsburg |
| Publisher | : CRC Press |
| Total Pages | : 440 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351835912 |
Download Thermal Design of Electronic Equipment Book in PDF, Epub and Kindle
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
| Author | : Lian-Tuu Yeh |
| Publisher | : American Society of Mechanical Engineers |
| Total Pages | : 454 |
| Release | : 2002 |
| Genre | : Science |
| ISBN | : |
Download Thermal Management of Microelectronic Equipment Book in PDF, Epub and Kindle
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
| Author | : Sadik Kakaç |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 953 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 9401110905 |
Download Cooling of Electronic Systems Book in PDF, Epub and Kindle
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
| Author | : Sung Jin Kim |
| Publisher | : CRC Press |
| Total Pages | : 264 |
| Release | : 2020-07-24 |
| Genre | : Technology & Engineering |
| ISBN | : 1000151743 |
Download Air Cooling Technology for Electronic Equipment Book in PDF, Epub and Kindle
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
| Author | : Xiaobing Luo |
| Publisher | : John Wiley & Sons |
| Total Pages | : 373 |
| Release | : 2024-08-12 |
| Genre | : Technology & Engineering |
| ISBN | : 1119179270 |
Download Thermal Management for Opto-electronics Packaging and Applications Book in PDF, Epub and Kindle
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
| Author | : Eric C. Guyer |
| Publisher | : CRC Press |
| Total Pages | : 710 |
| Release | : 1999-02-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9781560328117 |
Download Handbook of Applied Thermal Design Book in PDF, Epub and Kindle
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
| Author | : Younes Shabany |
| Publisher | : CRC Press |
| Total Pages | : 526 |
| Release | : 2009-12-17 |
| Genre | : Science |
| ISBN | : 1439814686 |
Download Heat Transfer Book in PDF, Epub and Kindle
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
