CMS Pixel Detector Upgrade and Top Quark Pole Mass Determination

CMS Pixel Detector Upgrade and Top Quark Pole Mass Determination
Author: Simon Spannagel
Publisher: Springer
Total Pages: 286
Release: 2017-08-01
Genre: Science
ISBN: 331958880X

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This thesis addresses two different topics, both vital for implementing modern high-energy physics experiments: detector development and data analysis. Providing a concise introduction to both the standard model of particle physics and the basic principles of semiconductor tracking detectors, it presents the first measurement of the top quark pole mass from the differential cross-section of tt+J events in the dileptonic tt decay channel. The first part focuses on the development and characterization of silicon pixel detectors. To account for the expected increase in luminosity of the Large Hadron Collider (LHC), the pixel detector of the compact muon solenoid (CMS) experiment is replaced by an upgraded detector with new front-end electronics. It presents comprehensive test beam studies conducted to verify the design and quantify the performance of the new front-end in terms of tracking efficiency and spatial resolution. Furthermore, it proposes a new cluster interpolation method, which utilizes the third central moment of the cluster charge distribution to improve the position resolution. The second part of the thesis introduces an alternative measurement of the top quark mass from the normalized differential production cross-sections of dileptonic top quark pair events with an additional jet. The energy measurement is 8TeV. Using theoretical predictions at next-to-leading order in perturbative Quantum Chromodynamics (QCD), the top quark pole mass is determined using a template fit method.

Study of the Inclusive Beauty Production at CMS and Construction and Commissioning of the CMS Pixel Barrel Detector

Study of the Inclusive Beauty Production at CMS and Construction and Commissioning of the CMS Pixel Barrel Detector
Author: Lea Caminada
Publisher: Springer Science & Business Media
Total Pages: 159
Release: 2012-03-02
Genre: Science
ISBN: 3642245625

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This thesis describes one of the first measurements made at CERN’s Large Hadron Collider, the world's largest and highest-energy particle collider. The method of analysis described in the first part is applied to the first CMS collision data collected after the LHC startup in 2010 and leads to the first experimental result for the inclusive b cross section using semileptonic decays at a center of mass energy of 7 TeV. The second part of the thesis describes the building and testing of the barrel pixel detector; the author herself played an important role in its construction, commissioning and first exploitation. The CMS collaboration Thesis Award Committee selected this work as the best thesis of the year 2010

Development of Pixel Module Assembly Processes for the Phase 2 Upgrade of the ATLAS Detector and Test Beam Measurements with Diamond Pixel Detectors

Development of Pixel Module Assembly Processes for the Phase 2 Upgrade of the ATLAS Detector and Test Beam Measurements with Diamond Pixel Detectors
Author: Helge Christoph Beck
Publisher:
Total Pages: 0
Release: 2019
Genre:
ISBN:

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One of the most powerful machines to study particle physics is the Large Hadron Collider (LHC). Starting in 2024, it will be upgraded to the High Luminosity-LHC (HL-LHC) to deliver even more data to measure with high precision Standard Model (SM) physics processes, and to maximise the potential to discover new physics. Higher luminosity implies a higher radiation environment, which poses challenges to the detectors of the experiments. To deal with radiation damage, pile up, and needed read-out speed, ATLAS will replace its current tracking detector with the new Inner Tracker (ITk). The inne...

The CMS Silicon Strip Tracker

The CMS Silicon Strip Tracker
Author: Oliver Pooth
Publisher: Springer Science & Business Media
Total Pages: 147
Release: 2010-04-11
Genre: Science
ISBN: 383489639X

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Oliver Pooth describes the silicon strip tracker of the CMS detector and discusses methods of quality control that are new to the field of particle detector physics. These methods were established to guarantee a uniform behaviour of all detector modules which were built and tested in various places worldwide.

Commissioning of the CMS Forward Pixel Detector

Commissioning of the CMS Forward Pixel Detector
Author:
Publisher:
Total Pages: 8
Release: 2008
Genre:
ISBN:

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The Compact Muon Solenoid (CMS) experiment is scheduled for physics data taking in summer 2009 after the commissioning of high energy proton-proton collisions at Large Hadron Collider (LHC). At the core of the CMS all-silicon tracker is the silicon pixel detector, comprising three barrel layers and two pixel disks in the forward and backward regions, accounting for a total of 66 million channels. The pixel detector will provide high-resolution, 3D tracking points, essential for pattern recognition and precise vertexing, while being embedded in a hostile radiation environment. The end disks of the pixel detector, known as the Forward Pixel detector, has been assembled and tested at Fermilab, USA. It has 18 million pixel cells with dimension 100 x 150 [mu]m2. The complete forward pixel detector was shipped to CERN in December 2007, where it underwent extensive system tests for commissioning prior to the installation. The pixel system was put in its final place inside the CMS following the installation and bake out of the LHC beam pipe in July 2008. It has been integrated with other sub-detectors in the readout since September 2008 and participated in the cosmic data taking. This report covers the strategy and results from commissioning of CMS forward pixel detector at CERN.

Status of the CMS Pixel Project

Status of the CMS Pixel Project
Author:
Publisher:
Total Pages: 3
Release: 2008
Genre:
ISBN:

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The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2008. The closest detector to the interaction point is the silicon pixel detector which is the heart of the tracking system. It consists of three barrel layers and two pixel disks on each side of the interaction point for a total of 66 million channels. Its proximity to the interaction point means there will be very large particle fluences and therefore a radiation-tolerant design is necessary. The pixel detector will be crucial to achieve a good vertex resolution and will play a key role in pattern recognition and track reconstruction. The results from test beam runs prove that the expected performances can be achieved. The detector is currently being assembled and will be ready for insertion into CMS in early 2008. During the assembly phase, a thorough electronic test is being done to check the functionality of each channel to guarantee the performance required to achieve the physics goals. This report will present the final detector design, the status of the production as well as results from test beam runs to validate the expected performance.

Development of Pixel Detector for ATLAS Inner Tracker(ITK) Upgrade at HL-LHC and Searching for the Standard Model Higgs Boson Decay Into B-quark Pair with ATLAS Experiment

Development of Pixel Detector for ATLAS Inner Tracker(ITK) Upgrade at HL-LHC and Searching for the Standard Model Higgs Boson Decay Into B-quark Pair with ATLAS Experiment
Author: Tasneem Saleem
Publisher:
Total Pages: 0
Release: 2019
Genre:
ISBN:

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ATLAS is one of the two main experiments at LHC with the purpose of investigating the microscopic properties of matter to address the most fundamental questions of particle physics. After the achievements of the first years of running, the potential reach for new discoveries and precise measurements at LHC is being extended by pushing further the energy and luminosity frontiers through three upgrades of the accelerator culminating in the High Luminosity LHC (HL-LHC). To fully profit from the increased luminosity, two main upgrades of the ATLAS inner detector are planned. The first upgrade was already completed at the beginning of 2015 with the insertion of the IBL, a fourth pixel layer located at just 3.2 cm from the beam line. In the second major upgrade, foreseen for 2024, the full inner detector will be replaced by a completely new inner tracker fully made of silicon devices to cope with the high particle density and the harsh radiation environment at the HL-LHC, which during its operational period will deliver 3000 fb-1, almost ten times the integrated luminosity of the full LHC program. This thesis addresses the study of new n+-in-p active edge pixel detectors by developing two novel doping profile analysis methods to study the radiation damage effects on the pixel detectors performance. These methods are the 3D sims imaging method and the TLM Method. TCAD simulation has been used to simulate the doping profiles, the electrical behavior and the radiation damage. Validating the simulation models with data have been done. Moreover, clean-room characterization, as well as testbeam measurement have been performed to test the different detector designs. In the second part of the thesis, I discuss the observation of the standard model Higgs boson bb decay mode using the data collected by ATLAS during the LHC Run2 at center-of-mass energy 13 TeV and an integrated luminosity 79.8 fb−1 of a proton-proton collision. I contributed specifically to the search of the standard model Higgs boson in VH(bb) production mode. In the VH(bb) analysis we don't have any channel that considers the tau leptons in the final state. I have performed a feasibility study to verify the gain of using the taus in the analysis. In addition, for the VH(bb) analysis I have worked on the multi-jet background estimation in the 1-lepton channel using the dijet-mass analysis method.

Semiconductor Packaging

Semiconductor Packaging
Author: Andrea Chen
Publisher: CRC Press
Total Pages: 218
Release: 2016-04-19
Genre: Technology & Engineering
ISBN: 1000218619

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.