Multi-level Interconnects for Heterojunction Bipolar Transistor Integrated Circuit Technologies

Multi-level Interconnects for Heterojunction Bipolar Transistor Integrated Circuit Technologies
Author:
Publisher:
Total Pages:
Release: 2001
Genre:
ISBN:

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Heterojunction bipolar transistors (HBTs) are mesa structures which present difficult planarization problems in integrated circuit fabrication. The authors report a multilevel metal interconnect technology using Benzocyclobutene (BCB) to implement high-speed, low-power photoreceivers based on InGaAs/InP HBTs. Processes for patterning and dry etching BCB to achieve smooth via holes with sloped sidewalls are presented. Excellent planarization of 1.9[micro]m mesa topographies on InGaAs/InP device structures is demonstrated using scanning electron microscopy (SEM). Additionally, SEM cross sections of both the multi-level metal interconnect via holes and the base emitter via holes required in the HBT IC process are presented. All via holes exhibit sloped sidewalls with slopes of 0.4[micro]m/[micro]m to 2[micro]m/[micro]m which are needed to realize a robust interconnect process. Specific contact resistances of the interconnects are found to be less than 6[times] 10[sup[minus]8][Omega]cm[sup 2]. Integrated circuits utilizing InGaAs/InP HBTs are fabricated to demonstrate the applicability and compatibility of the multi-level interconnect technology with integrated circuit processing.

High-speed Integrated Circuit Technology

High-speed Integrated Circuit Technology
Author: Mark J. W. Rodwell
Publisher: World Scientific
Total Pages: 374
Release: 2001
Genre: Technology & Engineering
ISBN: 9789812810014

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This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology. Contents: Preface (M J W Rodwell); High-Speed and High-Data-Bandwidth Transmitter and Receiver for Multi-Channel Serial Data Communication with CMOS Technology (M Fukaishi et al.); High-Performance Si and SiGe Bipolar Technologies and Circuits (M Wurzer et al.); Self-Aligned Si BJT/SiGe HBT Technology and Its Application to High-Speed Circuits (K Washio); Small-Scale InGaP/GaAs Heterojunction Bipolar Transistors for High-Speed and Low-Power Integrated-Circuit Applications (T Oka et al.); Prospects of InP-Based IC Technologies for 100-Gbit/S-Class Lightwave Communications Systems (T Enoki et al.); Scaling of InGaAs/InAlAs HBTs for High Speed Mixed-Signal and mm-Wave ICs (M J W Rodwell); Progress Toward 100 GHz Logic in InP HBT IC Technology (C H Fields et al.); Cantilevered Base InP DHBT for High Speed Digital Applications (A L Gutierrez-Aitken et al.); RSFQ Technology: Physics and Devices (P Bunyk et al.); RSFQ Technology: Circuits and Systems (D K Brock). Readership: Researchers, industrialists and academics in electrical and electronic engineering.

Multilevel Interconnect Technology

Multilevel Interconnect Technology
Author: Gopal K. Rao
Publisher: McGraw-Hill Companies
Total Pages: 250
Release: 1993
Genre: Computers
ISBN:

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The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.

Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration
Author: Jeffrey A. Davis
Publisher: Springer Science & Business Media
Total Pages: 417
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461504619

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This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Proceedings

Proceedings
Author:
Publisher:
Total Pages: 1500
Release: 1996
Genre: Electronic apparatus and appliances
ISBN:

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Variation Tolerant On-Chip Interconnects

Variation Tolerant On-Chip Interconnects
Author: Ethiopia Enideg Nigussie
Publisher: Springer Science & Business Media
Total Pages: 177
Release: 2011-12-02
Genre: Technology & Engineering
ISBN: 1461401313

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This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.