MOSFET Modeling, Simulation and Parameter Extraction in 4H- 6H- Silicon Carbide

MOSFET Modeling, Simulation and Parameter Extraction in 4H- 6H- Silicon Carbide
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Publisher:
Total Pages:
Release: 2005
Genre:
ISBN:
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This thesis presents the work on analytical modeling and simulation of a silicon carbide (SiC) power MOSFET, model verification with test data, and device characterization and parameter extraction of the SPICE model. The development of temperature models for a lateral as well as a vertical MOSFET in SiC are also presented. The model takes into account the various short channel effects in the DIMOS channel region as well as the velocity saturation effect in the drift region. Considering the SiC material processing limitations and feedback from the system level application group, an application specific SiC power MOSFET structure has been proposed. The device dimensions were chosen to obtain the desired specific on-resistance and breakdown voltage of the power MOSFET. A good agreement between the analytical model and the MEDICI simulation is demonstrated. The temperature models include effects of temperature on the threshold voltage, carrier mobility, the body leakage current, and the drain and source contact region resistances for a lateral MOSFET and the effects of temperature on the threshold voltage, carrier mobility, the body leakage current, drift region resistance and channel resistance for a vertical MOSFET. The temperature dependent compensating current elements are introduced in the model. These compensating currents contribute to the total current at high temperatures. A rigorous testing and characterization has been carried out on a 4H-SiC DIMOS transistor test device. SPICE parameters have been extracted from the measurements and a SPICE model for the DIMOS transistor has been developed. The models developed in this research will not only help the SiC device researchers in the device behavioral study but will also provide a SPICE model for circuit designers.

Analysis and Design of MOSFETs

Analysis and Design of MOSFETs
Author: Juin Jei Liou
Publisher: Springer Science & Business Media
Total Pages: 356
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461554152
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Analysis and Design of MOSFETs: Modeling, Simulation, and Parameter Extraction is the first book devoted entirely to a broad spectrum of analysis and design issues related to the semiconductor device called metal-oxide semiconductor field-effect transistor (MOSFET). These issues include MOSFET device physics, modeling, numerical simulation, and parameter extraction. The discussion of the application of device simulation to the extraction of MOSFET parameters, such as the threshold voltage, effective channel lengths, and series resistances, is of particular interest to all readers and provides a valuable learning and reference tool for students, researchers and engineers. Analysis and Design of MOSFETs: Modeling, Simulation, and Parameter Extraction, extensively referenced, and containing more than 180 illustrations, is an innovative and integral new book on MOSFETs design technology.

Bsim4 And Mosfet Modeling For Ic Simulation

Bsim4 And Mosfet Modeling For Ic Simulation
Author: Chenming Hu
Publisher: World Scientific
Total Pages: 435
Release: 2011-11-25
Genre: Technology & Engineering
ISBN: 9814390968
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This book presents the art of advanced MOSFET modeling for integrated circuit simulation and design. It provides the essential mathematical and physical analyses of all the electrical, mechanical and thermal effects in MOS transistors relevant to the operation of integrated circuits. Particular emphasis is placed on how the BSIM model evolved into the first ever industry standard SPICE MOSFET model for circuit simulation and CMOS technology development.The discussion covers the theory and methodology of how a MOSFET model, or semiconductor device models in general, can be implemented to be robust and efficient, turning device physics theory into a production-worthy SPICE simulation model.Special attention is paid to MOSFET characterization and model parameter extraction methodologies, making the book particularly useful for those interested or already engaged in work in the areas of semiconductor devices, compact modeling for SPICE simulation, and integrated circuit design.

Modeling and Validation of 4H-SiC Low Voltage MOSFETs for Integrated Circuit Design

Modeling and Validation of 4H-SiC Low Voltage MOSFETs for Integrated Circuit Design
Author: Shamim Ahmed
Publisher:
Total Pages: 594
Release: 2017
Genre: Integrated circuits
ISBN:
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Silicon Carbide is a promising wide bandgap material and gradually becoming the first choice of semiconductor for high density and high efficiency power electronics in medium voltage range (500-1500V). SiC has also excellent thermal conductivity and the devices fabricated with the material can operate at high temperature ( ̃400 0C). Thus, a power electronic system built with SiC devices requires less cooling requirement and saves board space and cost. The high temperature applications of SiC material can also be extended to space exploration, oil and gas rigging, aerospace and geothermal energy systems for data acquisition, sensing and instrumentation and power conditioning and conversion. But the high temperature capability of SiC can only be utilized when the integrated circuits can be designed in SiC technology and high fidelity compact models of the semiconductor devices are a priori for reliable and high yielding integrated circuit design. The objective of this work is to develop industry standard compact models for SiC NMOS and PMOS devices. A widely used compact model used in silicon industry called BSIM3V3 is adopted as a foundation to build the model for SiC MOSFET. The models optimized with the built-in HSPICE BSIM3V3.3 were used for circuit design in one tape-out but BSIM3V3 was found to be inadequate to model all of the characteristics of SiC MOSFET due to the presence of interface trapped charge. In the second tape-out, the models for SiC NMOS and PMOS were optimized based on the built-in HSPICE BSIM4V6.5 and a number of functioning circuits which have been published in reputed journal and conference were designed based on the models. Although BSIM4 is an enhanced version of BSIM3V3, it also could not model a few deviant SiC MOSFET characteristics such as body effect, soft saturation etc. The new model developed for SiC NMOS and PMOS based on BSIM4V7.0 is called BSIM4SIC and can model the entire range of device characteristics of the devices. The BSIM4SIC models are validated with a wide range of measured data and verified using the models in the simulation of numerous circuits such as op-amp, comparator, linear regulator, reference and ADC/DAC.

Power Electronics and Power Quality

Power Electronics and Power Quality
Author: José Gabriel Oliveira Pinto
Publisher: MDPI
Total Pages: 336
Release: 2020-04-23
Genre: Technology & Engineering
ISBN: 3039283588
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Power quality (PQ) is receiving more and more attention from consumers, distribution system operators, transmission system operators, and other entities related to electrical power systems. As PQ problems have direct implications for business productivity, causing high economic losses, the research and development monitoring technologies and power electronics solutions that ensure the PQ of the power systems are matters of utmost importance. This book is a collection of high quality papers published in the “Power Electronics and Power Quality” Special Issue of the journal Energies. It reflects on the latest investigations and the new trends in this field.

Design and Application of SiC Power MOSFET

Design and Application of SiC Power MOSFET
Author:
Publisher:
Total Pages:
Release: 2003
Genre: Metal oxide semiconductor field-effect transistors
ISBN:
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This thesis focuses on the design of high voltage MOSFET on SiC and its application in power electronic systems. Parameters extraction for 4H SiC MOS devices is the main focus of the first topic developed in this thesis. Calibration of two-dimensional(2-D) device and circuit simulators (MEDICI and SPICE) with state-of-the-art 4H SiC MOSFETs data are performed, which includes the mobility parameter extraction. The experimental data were obtained from lateral N-channel 4H SiC MOSFETs with nitrided oxide-semiconductor interfaces, exhibiting normal mobility behavior. The presence of increasing interface-trap density (Dit) toward the edge of the conduction band is included during the 2-D device simulation. Using measured distribution of interface-trap density for simulation of the transfer characteristics leads to good agreement with the experimental transfer characteristic. The results demonstrate that both MEDICI and SPICE simulators can be used for design and optimization of 4H SiC MOSFETs and the circuits utilizing these MOSFETs. Based on critical review of SiC power MOSFETs, a new structure of SiC accumulation-mode MOSFET(ACCUFET) designed to address most of the open issues related to MOS interface is proposed. Detailed analysis of the important design parameters of the novel structure is performed using MEDICI with the parameter set used in the calibration process. The novel structure was also compared to alternative ACCUFET approaches, specifically planar and trench-gate ACCUFETs. The comparison shows that the novel structure provides the highest figure of merit for power devices. The analysis of circuit advantages enabled by the novel SiC ACCUFET is given in the final part of this thesis. The results from circuit simulation show that by utilizing the novel SiC ACCUFET the operating frequency of the circuit can be increased 10 times for the same power efficiency of the system. This leads to dramatic improvements in size, weight, cost and thermal management of power electronic systems.

Design and Fabrication of 4H Silicon Carbide MOSFETS

Design and Fabrication of 4H Silicon Carbide MOSFETS
Author: Jian Wu
Publisher:
Total Pages: 158
Release: 2009
Genre: Metal oxide semiconductor field-effect transistors
ISBN:
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The 4H-SiC power MOSFET is an excellent candidate for power applications. Major technical difficulties in the development of 4H-SiC power MOSFET have been low MOS channel mobility and gate oxide reliability. In this dissertation, a novel 4H-SiC power MOSFET structure has been presented with the aim of solving these problems. The research started from the study and improvement of the channel mobility of lateral trench-gate MOSFET that features an accumulation channel for high channel mobility. The design, fabrication and characterization of lateral trench-gate MOSFET are presented. The fabricated lateral trench-gate MOSFET with an accumulation channel of 0.15 [micrometers] exhibited a high peak channel mobility of 95 cm2/Vs at room temperature and 255 cm2/Vs at 200oC with stable normally-off operation. Based on the successful demonstration of high channel mobility, a vertical trench-gate power MOSFET structure has been designed and developed. This structure also features an epitaxial N-type accumulation channel to take advantage of high channel mobility. Moreover, this structure introduces a submicron N-type vertical channel by counter-doping the P base region via a low-dose nitrogen ion implantation. The implanted vertical channel provides effective shielding for gate oxide from high electric field. A process using the oxidation of polysilicon was developed to achieve self-alignment between the submicron vertical channel and the gate trench. A "sandwich" process, including nitric oxide growth, dry oxygen growth and nitric oxide annealing, was incorporated to grow high-quality gate oxide. The fabricated single-gate vertical MOSFET can block up to 890 V at zero gate bias. The device exhibited a low specific on-resistance of 9.3 m[omega]cm2 at VGS=70 V, resulting in an improved FOM () of 85 MW/cm2. A large-area MOSFET with an active area of 4.26x10-2 cm2 can block up to 810V with a low leakage current of 21 [micro]A and conducted a high on-current of 1 A at VDS=3 V and VGS=50 V. The fabricated devices all exhibited the stable normally-off operation with threshold voltages of 5~6 V. Their subthreshold characteristics with high on/off ratios of 3~5 indicates that the MOSFETs are capable of operating stably as switching devices.

ICCWCS 2019

ICCWCS 2019
Author: Jamal Zbitou
Publisher: European Alliance for Innovation
Total Pages: 564
Release:
Genre: Technology & Engineering
ISBN: 1631901818
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Today, computer science engineering and telecommunications are two important areas linked and even inseparable. This is obvious for the user who connects the modem of his computer on his mobile phone or telephone line to access, via the global data network, the information available on the servers. The both domains are evolving rapidly and the development of new architectures of systems dedicated to telecommunications and computing becomes essential. Especially, wireless transmission systems with high data rate. Two parts of these systems should be developed software and hardware. Another area that is renewable energies becomes more attractive for researchers in order to develop new conversion systems with good performances, and a good optimization of energy. For example, in wireless sensor systems, we try to develop new protocols permitting to have a good autonomy in terms of energy.

MOSFET Parameter Extraction and Spice Modeling

MOSFET Parameter Extraction and Spice Modeling
Author: Sai Subhash Sripada
Publisher:
Total Pages: 65
Release: 2015
Genre: Electronic circuit design
ISBN: 9781339070025
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This paper proposes a simple extraction technique which can be used to extract device parameters of any power MOSFET easily. It only requires the use of transfer and output characteristic graphs to extract threshold voltage and transconductance and a few formulas to extract the parasitic capacitances of the power device. The extraction technique is presented in an easy to understand step by step procedure. The parameters extracted using this process are used to develop a spice model. Transient analysis is done for the extracted model and the resistive switching performance is compared with the datasheet in order to prove the effectiveness of the extraction technique used. Inductive switching is also done for the extracted model and the effect of varying the parameters of the MOSFET on inductive switching times is observed. Finally, this observation is then used to develop a new mathematical SiC power MOSFET model which has better inductive switching times than the extracted model and the thesis is concluded.