Modeling and Simulation of High Speed VLSI Interconnects

Modeling and Simulation of High Speed VLSI Interconnects
Author: Michel S. Nakhla
Publisher: Springer Science & Business Media
Total Pages: 104
Release: 2011-06-28
Genre: Technology & Engineering
ISBN: 146152718X

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Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

High-Speed VLSI Interconnections

High-Speed VLSI Interconnections
Author: Ashok K. Goel
Publisher: John Wiley & Sons
Total Pages: 433
Release: 2007-10-19
Genre: Technology & Engineering
ISBN: 0470165960

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This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Compact Models and Measurement Techniques for High-Speed Interconnects

Compact Models and Measurement Techniques for High-Speed Interconnects
Author: Rohit Sharma
Publisher: Springer Science & Business Media
Total Pages: 81
Release: 2012-02-17
Genre: Technology & Engineering
ISBN: 1461410711

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Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

Compact Models and Measurement Techniques for High-Speed Interconnects

Compact Models and Measurement Techniques for High-Speed Interconnects
Author: Rohit Sharma
Publisher: Springer Science & Business Media
Total Pages: 81
Release: 2012-02-17
Genre: Technology & Engineering
ISBN: 1461410703

Download Compact Models and Measurement Techniques for High-Speed Interconnects Book in PDF, Epub and Kindle

Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

The VLSI Handbook

The VLSI Handbook
Author: Wai-Kai Chen
Publisher: CRC Press
Total Pages: 2320
Release: 2018-10-03
Genre: Technology & Engineering
ISBN: 1420005960

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For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.

Fast Algorithms for High Frequency Interconnect Modeling in VLSI Circuits and Packages

Fast Algorithms for High Frequency Interconnect Modeling in VLSI Circuits and Packages
Author: Yang Yi
Publisher:
Total Pages:
Release: 2011
Genre:
ISBN:

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Interconnect modeling plays an important role in design and verification of VLSI circuits and packages. For low frequency circuits, great advances for parasitic resistance and capacitance extraction have been achieved and wide varieties of techniques are available. However, for high frequency circuits and packages, parasitic inductance and impedance extraction still poses a tremendous challenge. Existing algorithms, such as FastImp and FastHenry developed by MIT, are slow and inherently unable to handle multiple dielectrics and magnetic materials. In this research, we solve three problems in interconnect modeling for high frequency circuits and packages. 1) Multiple dielectrics are common in integrated circuits and packages. We propose the first Boundary Element Method (BEM) algorithm for impedance extraction of interconnects with multiple dielectrics. The algorithm uses a novel equivalentcharge formulation to model the extraction problem with significantly fewer unknowns. Then fast matrix-vector multiplication and effective preconditioning techniques are applied to speed up the solution of linear systems. Experimental results show that the algorithm is significantly faster than existing methods with sufficient accuracy. 2) Magnetic materials are widely used in MEMS, RFID and MRAM. We present the first BEM algorithm to extract interconnect inductance with magnetic materials. The algorithm models magnetic characteristics by the Landau Lifshitz Gilbert equation and fictitious magnetic charges. The algorithm is accelerated by approximating magnetic charge effects and by modeling currents with solenoidal basis. The relative error of the algorithm with respect to the commercial tool is below 3%, while the speed is up to one magnitude faster. 3) Since traditional interconnect model includes mutual inductances between pairs of segments, the resulting circuit matrix is very dense. This has been the main bottleneck in the use of the interconnect model. Recently, K = L-1 is used. The RKC model is sparse and stable. We study the practical issues of the RKC model. We validate the RKC model and propose an efficient way to achieve high accuracy extraction by circuit simulations of practical examples.

Directions for the Next Generation of MMIC Devices and Systems

Directions for the Next Generation of MMIC Devices and Systems
Author: Nirod K. Das
Publisher: Springer Science & Business Media
Total Pages: 410
Release: 2013-11-11
Genre: Technology & Engineering
ISBN: 1489914803

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Proceedings of the 1996 WRI International Symposium held in New York City, September 11-13, 1996

Surrogate Modeling for High-Frequency Design: Recent Advances

Surrogate Modeling for High-Frequency Design: Recent Advances
Author: Slawomir Koziel
Publisher: World Scientific Publishing Europe Limited
Total Pages: 398
Release: 2021
Genre: Technology & Engineering
ISBN: 9781800610743

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"Contemporary high-frequency engineering design heavily relies on full-wave electromagnetic (EM) analysis. This is primarily due to its versatility and ability to account for phenomena that are important from the point of view of system performance. Unfortunately, versatility comes at the price of a high computational cost of accurate evaluation. Consequently, utilization of simulation models in the design processes is challenging although highly desirable. Surrogate Modeling for High-Frequency Design presents a selection of works representing recent advancements in surrogate modeling and their applications to high-frequency design. Some chapters provide a review of specific topics such as neural network modeling of microwave components, while others describe recent attempts to improve existing modeling methodologies. Furthermore, the book features numerous applications of surrogate modeling methodologies to design optimization and uncertainty quantification of antenna, microwave, and analog RF circuits"--