3D Interconnect Architectures for Heterogeneous Technologies

3D Interconnect Architectures for Heterogeneous Technologies
Author: Lennart Bamberg
Publisher: Springer Nature
Total Pages: 403
Release: 2022-06-27
Genre: Technology & Engineering
ISBN: 3030982297

Download 3D Interconnect Architectures for Heterogeneous Technologies Book in PDF, Epub and Kindle

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

Low Power Interconnect Design

Low Power Interconnect Design
Author: Sandeep Saini
Publisher: Springer
Total Pages: 166
Release: 2015-06-12
Genre: Technology & Engineering
ISBN: 1461413230

Download Low Power Interconnect Design Book in PDF, Epub and Kindle

This book provides practical solutions for delay and power reduction for on-chip interconnects and buses. It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system. Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.

Interconnect Technologies for Integrated Circuits and Flexible Electronics

Interconnect Technologies for Integrated Circuits and Flexible Electronics
Author: Yash Agrawal
Publisher: Springer Nature
Total Pages: 286
Release: 2023-10-17
Genre: Technology & Engineering
ISBN: 9819944767

Download Interconnect Technologies for Integrated Circuits and Flexible Electronics Book in PDF, Epub and Kindle

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration
Author: Jeffrey A. Davis
Publisher: Springer Science & Business Media
Total Pages: 417
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461504619

Download Interconnect Technology and Design for Gigascale Integration Book in PDF, Epub and Kindle

This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Modeling and Optimization of Interconnects and Package for Signal and Power Integrity

Modeling and Optimization of Interconnects and Package for Signal and Power Integrity
Author: Jun Chen
Publisher:
Total Pages: 290
Release: 2006
Genre:
ISBN: 9780542796784

Download Modeling and Optimization of Interconnects and Package for Signal and Power Integrity Book in PDF, Epub and Kindle

We further study the decoupling capacitor optimization problem for the power integrity of packages. We develop an incremental noise computation method based on FFT over incremental impedance matrix evaluation, and then use the simulated annealing algorithm to minimize the total cost of decoupling capacitors under the constraints of a noise bound. Compared to the existing impedance based approaches, our algorithm reduces the decoupling capacitor cost by 3x and is also more than 10x faster.

Interconnect-Centric Design for Advanced SOC and NOC

Interconnect-Centric Design for Advanced SOC and NOC
Author: Jari Nurmi
Publisher: Springer Science & Business Media
Total Pages: 474
Release: 2004-07-20
Genre: Computers
ISBN: 9781402078354

Download Interconnect-Centric Design for Advanced SOC and NOC Book in PDF, Epub and Kindle

In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

Interconnect Noise Optimization in Nanometer Technologies

Interconnect Noise Optimization in Nanometer Technologies
Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
Total Pages: 166
Release: 2005-11-21
Genre: Technology & Engineering
ISBN: 9780387258706

Download Interconnect Noise Optimization in Nanometer Technologies Book in PDF, Epub and Kindle

Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits