Microelectronic Device And Multilevel Interconnection Technology Ii
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Author | : Ih-Chin Chen |
Publisher | : SPIE-International Society for Optical Engineering |
Total Pages | : 392 |
Release | : 1996-01-01 |
Genre | : Interconnects (Integrated circuit technology) |
ISBN | : 9780819422736 |
Download Microelectronic Device and Multilevel Interconnection Technology II Book in PDF, Epub and Kindle
Author | : |
Publisher | : |
Total Pages | : 414 |
Release | : 1996 |
Genre | : Microelectronics |
ISBN | : |
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Author | : |
Publisher | : |
Total Pages | : |
Release | : 1995 |
Genre | : |
ISBN | : |
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Author | : Ih-Chin Chen |
Publisher | : Society of Photo Optical |
Total Pages | : 326 |
Release | : 1995 |
Genre | : Technology & Engineering |
ISBN | : 9780819420022 |
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Author | : |
Publisher | : |
Total Pages | : 342 |
Release | : 1995 |
Genre | : Microelectronics |
ISBN | : |
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Author | : G.G. Harman |
Publisher | : Springer Science & Business Media |
Total Pages | : 295 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9401151350 |
Download Microelectronic Interconnections and Assembly Book in PDF, Epub and Kindle
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author | : Vojin G. Oklobdzija |
Publisher | : CRC Press |
Total Pages | : 1422 |
Release | : 2001-12-26 |
Genre | : Computers |
ISBN | : 9780849308857 |
Download The Computer Engineering Handbook Book in PDF, Epub and Kindle
There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own. References published only a few years ago are now sorely out of date. The Computer Engineering Handbook changes all of that. Under the leadership of Vojin Oklobdzija and a stellar editorial board, some of the industry's foremost experts have joined forces to create what promises to be the definitive resource for computer design and engineering. Instead of focusing on basic, introductory material, it forms a comprehensive, state-of-the-art review of the field's most recent achievements, outstanding issues, and future directions. The world of computer engineering is vast and evolving so rapidly that what is cutting-edge today may be obsolete in a few months. While exploring the new developments, trends, and future directions of the field, The Computer Engineering Handbook captures what is fundamental and of lasting value.
Author | : Jeffrey A. Davis |
Publisher | : Springer Science & Business Media |
Total Pages | : 417 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461504619 |
Download Interconnect Technology and Design for Gigascale Integration Book in PDF, Epub and Kindle
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Author | : Mart Graef |
Publisher | : |
Total Pages | : 132 |
Release | : 1997 |
Genre | : Electronic books |
ISBN | : |
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Author | : |
Publisher | : |
Total Pages | : 326 |
Release | : 1999 |
Genre | : Microelectronics |
ISBN | : |
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