Microelectronic Device And Multilevel Interconnection Technology
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Author | : |
Publisher | : |
Total Pages | : 414 |
Release | : 1996 |
Genre | : Microelectronics |
ISBN | : |
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Author | : Ih-Chin Chen |
Publisher | : Society of Photo Optical |
Total Pages | : 326 |
Release | : 1995 |
Genre | : Technology & Engineering |
ISBN | : 9780819420022 |
Download Microelectronic Device and Multilevel Interconnection Technology Book in PDF, Epub and Kindle
Author | : |
Publisher | : |
Total Pages | : |
Release | : 1995 |
Genre | : |
ISBN | : |
Download Microelectronic Device and Multilevel Interconnection Technology Book in PDF, Epub and Kindle
Author | : Ih-Chin Chen |
Publisher | : SPIE-International Society for Optical Engineering |
Total Pages | : 392 |
Release | : 1996-01-01 |
Genre | : Interconnects (Integrated circuit technology) |
ISBN | : 9780819422736 |
Download Microelectronic Device and Multilevel Interconnection Technology II Book in PDF, Epub and Kindle
Author | : |
Publisher | : |
Total Pages | : 342 |
Release | : 1995 |
Genre | : Microelectronics |
ISBN | : |
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Author | : G.G. Harman |
Publisher | : Springer Science & Business Media |
Total Pages | : 295 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9401151350 |
Download Microelectronic Interconnections and Assembly Book in PDF, Epub and Kindle
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author | : Jeffrey A. Davis |
Publisher | : Springer Science & Business Media |
Total Pages | : 417 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461504619 |
Download Interconnect Technology and Design for Gigascale Integration Book in PDF, Epub and Kindle
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Author | : |
Publisher | : |
Total Pages | : 326 |
Release | : 1999 |
Genre | : Microelectronics |
ISBN | : |
Download Microelectronic Device Technology Book in PDF, Epub and Kindle
Author | : Ashok Goel |
Publisher | : Momentum Press |
Total Pages | : 394 |
Release | : 2014-12-29 |
Genre | : Technology & Engineering |
ISBN | : 1606505130 |
Download A One-Semester Course in Modeling of VSLI Interconnections Book in PDF, Epub and Kindle
Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Author | : Electrochemical Society. Dielectric Science and Technology Division |
Publisher | : The Electrochemical Society |
Total Pages | : 346 |
Release | : 1992 |
Genre | : Technology & Engineering |
ISBN | : 9781566770033 |
Download Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications Book in PDF, Epub and Kindle
Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.