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| Author | : James William Peterson |
| Publisher | : |
| Total Pages | : 56 |
| Release | : 1985 |
| Genre | : |
| ISBN | : |
| Author | : L. B. Rothman |
| Publisher | : |
| Total Pages | : 288 |
| Release | : 1987 |
| Genre | : Electronics |
| ISBN | : |
| Author | : R.A. Levy |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 444 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 1461305411 |
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
| Author | : Reza Ghodssi |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1211 |
| Release | : 2011-03-18 |
| Genre | : Technology & Engineering |
| ISBN | : 0387473181 |
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
| Author | : Shi-Yong Yang |
| Publisher | : Elsevier |
| Total Pages | : 499 |
| Release | : 2018-04-20 |
| Genre | : Technology & Engineering |
| ISBN | : 0128126418 |
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared
| Author | : Yoshio Nishi |
| Publisher | : CRC Press |
| Total Pages | : 1186 |
| Release | : 2000-08-09 |
| Genre | : Technology & Engineering |
| ISBN | : 9780824787837 |
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
| Author | : |
| Publisher | : |
| Total Pages | : 1572 |
| Release | : 1992 |
| Genre | : Aeronautics |
| ISBN | : |
| Author | : Peter Wellmann |
| Publisher | : John Wiley & Sons |
| Total Pages | : 743 |
| Release | : 2022-01-10 |
| Genre | : Technology & Engineering |
| ISBN | : 3527346716 |
Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.
| Author | : |
| Publisher | : |
| Total Pages | : 642 |
| Release | : 1983 |
| Genre | : Electrical engineering |
| ISBN | : |
| Author | : Jihperng Leu |
| Publisher | : |
| Total Pages | : 436 |
| Release | : 1990 |
| Genre | : |
| ISBN | : |
