Liquid Cooling of Electronic Devices by Single-Phase Convection

Liquid Cooling of Electronic Devices by Single-Phase Convection
Author: Frank P. Incropera
Publisher: Wiley-Interscience
Total Pages: 312
Release: 1999-05-31
Genre: Technology & Engineering
ISBN:

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Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Author: Madhusudan Iyengar
Publisher: World Scientific
Total Pages: 479
Release: 2024-01-10
Genre: Technology & Engineering
ISBN: 9811279381

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This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Cooling of Electronic Systems

Cooling of Electronic Systems
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
Total Pages: 953
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 9401110905

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Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Air Cooling Technology for Electronic Equipment

Air Cooling Technology for Electronic Equipment
Author: Sung Jin Kim
Publisher: CRC Press
Total Pages: 264
Release: 2020-07-24
Genre: Technology & Engineering
ISBN: 1000151743

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Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

Electronics Cooling

Electronics Cooling
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
Total Pages: 184
Release: 2016-06-15
Genre: Computers
ISBN: 9535124056

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Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Cooling of Electronic Equipment

Cooling of Electronic Equipment
Author: Allan W. Scott
Publisher: Wiley-Interscience
Total Pages: 312
Release: 1974
Genre: Technology & Engineering
ISBN:

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Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
Author: Madhusudan Iyengar
Publisher: World Scientific
Total Pages: 471
Release: 2014-08-25
Genre: Technology & Engineering
ISBN: 9814579807

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To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase Convection

Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase Convection
Author: Madhusudan Iyengar
Publisher: World Scientific Publishing Company
Total Pages: 0
Release: 2024-02-15
Genre: Technology & Engineering
ISBN: 9789811277931

Download Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase Convection Book in PDF, Epub and Kindle

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Single Phase Liquid Immersion Cooling of Discrete Heat Sources in a Vertical Channel

Single Phase Liquid Immersion Cooling of Discrete Heat Sources in a Vertical Channel
Author: Sherrill John III. Hazard
Publisher:
Total Pages: 160
Release: 1987
Genre:
ISBN:

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Natural convection liquid cooling of simulated electronic components was investigated. A single column of eight protruding components was constructed using foil heaters mounted on the back of stainless steel rectangular blocks. These components were attached to a vertical plexiglass wall to simulate a column of 20 pin DIP's. A channel was formed by placing a smooth movable shrouding wall parallel to the test surface. The test surface and the shrouding wall were placed in a water immersion bath. Flow visualization was accomplished using a laser generated plane of light to illuminate suspended particles. Photographs were taken of the flow at the test surface mid-plane for four different power settings at each of three different channel widths. A nondimensional temperature and a modified Grashof number for each heated protrusion at each input power setting and channel width were determined. Keywords: Immersion cooling; Protruding heat sources; Vertical channels; Flow visualization.