Layered Materials for Structural Applications: Volume 434

Layered Materials for Structural Applications: Volume 434
Author: J. J. Lewandowski
Publisher:
Total Pages: 336
Release: 1996-10-22
Genre: Technology & Engineering
ISBN:

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Layered materials and systems based on metallic, intermetallic, polymeric and ceramic constituents have become increasingly important in meeting the structural requirements of current and future high-performance products. This book brings together investigators from industry, academia and government to focus on the structural applications of layered systems. Thermal barrier coatings, aircraft structural components and wear-resistant coatings for a wide variety of applications are highlighted. Processing techniques such as EB deposition, reactive sputter deposition, sedimentation processing, pressureless cosintering and rapid prototyping via laminated object manufacturing are also covered. And while microstability issues are addressed, they appear to be a critical area where further investigation is required. The largest number of papers focus on the mechanical behavior and modelling of layered systems and reveal significant effects of layer thickness, spacing and constituent properties on the fracture and fatigue behavior of such systems. Topics include: applications; processing; stability issues and mechanical behavior.

Layered Materials for Structural Applications

Layered Materials for Structural Applications
Author:
Publisher:
Total Pages: 0
Release: 1996
Genre:
ISBN:

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Layered materials and systems based on metallic, intermetallic, polymeric and ceramic constituents are becoming increasingly important to meet the structural requirements of current and future high-performance products. This award was used to support a symposium entitled "Layered Materials for Structural Applications," sponsored by the Materials Research Society. The symposium drew 41 invited and contributed papers. The symposium was divided into four emphasis areas: Applications, Processing, Stability Issues, and Mechanical Behavior. A symposium proceedings was published and is available through the Materials Research Society as Symposium Proceedings, Volume 434.

Materials Research Society Symposium Proceedings. Volume 434. Layered Materials for Structural Applications. April 8-11, 1996, San Francisco, California

Materials Research Society Symposium Proceedings. Volume 434. Layered Materials for Structural Applications. April 8-11, 1996, San Francisco, California
Author:
Publisher:
Total Pages: 312
Release: 1996
Genre:
ISBN:

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Layered materials and systems based on metallic, intermetallic, polymeric and ceramic constituents are becoming increasingly important to meet the structural requirements of current and future high-performance products. In response to various research and development activities in these areas, Symposium was organized to cover a range of topics dealing with layered materials for structural applications and was supported by contributions from The Air Force Office of Scientific Research and Office of Naval Research. The support of these organizations is gratefully acknowledged. This proceedings volume is based on the first MRS symposium dedicated to current research and development of layered materials which are being considered for a range of structural applications. The meeting began with overviews on structural applications of layered systems and highlighted applications such as thermal barrier coatings, aircraft structural components, and wear-resistant coatings for a variety of applications. Processing techniques such as EB deposition processing, reactive sputter deposition, sedimentation processing, pressureless co- sintering, and rapid prototyping via laminated object manufacturing were subsequently covered. Microstructural stability issues were additionally covered and highlighted as a critical area requiring further investigation. The largest number of papers presented focused on the mechanical behavior and modeling of layered systems and revealed significant effects of layer thickness, spacing, and constituent properties on the fracture and fatigue behavior of such systems. While considerable work has investigated the issues of strength and toughness, less effort has been focused on the behavior of such systems under either cyclic loading or high-temperature conditions.

Low-Dielectric Constant Materials II: Volume 443

Low-Dielectric Constant Materials II: Volume 443
Author: André Lagendijk
Publisher:
Total Pages: 224
Release: 1997-08-19
Genre: Technology & Engineering
ISBN:

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Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

Structure and Evolution of Surfaces: Volume 440

Structure and Evolution of Surfaces: Volume 440
Author: Robert C. Cammarata
Publisher:
Total Pages: 536
Release: 1997-11-13
Genre: Science
ISBN:

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This book brings together an interdisciplinary group of surface physicists, chemists and materials scientists to present the most current advances in the area of surface science. Both scientific and technological issues are addressed. Topics include: surface and step structure; morphology, roughness and instabilities; kinetic processes; nucleation on surfaces and interfaces; mechanics of surfaces; self-assembled and Langmuir-Blodgett films; thin-film surfaces and growth; chemistry and modification of surfaces and metal-semiconductor interfaces.

Materials Reliability in Microelectronics VI: Volume 428

Materials Reliability in Microelectronics VI: Volume 428
Author: William F. Filter
Publisher:
Total Pages: 616
Release: 1996-11-18
Genre: Technology & Engineering
ISBN:

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MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.

Electronic Packaging Materials Science IX: Volume 445

Electronic Packaging Materials Science IX: Volume 445
Author: Steven K. Groothuis
Publisher:
Total Pages: 344
Release: 1997-10-20
Genre: Technology & Engineering
ISBN:

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While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Materials for Mechanical and Optical Microsystems: Volume 444

Materials for Mechanical and Optical Microsystems: Volume 444
Author: Michael L. Reed
Publisher:
Total Pages: 264
Release: 1997-03-30
Genre: Mathematics
ISBN:

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A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR

Applications of Synchrotron Radiation to III: Volume 437

Applications of Synchrotron Radiation to III: Volume 437
Author: Louis J. Terminello
Publisher:
Total Pages: 282
Release: 1996-12-03
Genre: Technology & Engineering
ISBN:

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As third-generation synchrotron facilities are constructed and go online in both the United States and around the world, increasingly more applications of synchrotron radiation will be realized. Both basic and applied research possibilities are manyfold, and include studies of solid surfaces and interfaces, electronic materials, metal oxides, glasses, thin films, superconductors, polymers, alloys, multilayer metal systems and intermetallic compounds. In addition, the combination of synchrotron-based spectroscopic techniques, with ever increasing high-resolution microscopy, allows researchers to study very small domains of materials in an attempt to understand their chemical and electronic properties. This book from MRS focuses on the various types of information that can be obtained from synchrotron-related techniques in order to expand the use of this unique and powerful experimental approach to materials research. Topics include: structure of reduced dimensional materials; magnetic materials; microscopy, topography and tomography; X-ray probes of solids; and materials characterization with X-ray absorption.

Scientific Basis for Nuclear Waste Management XX: Volume 465

Scientific Basis for Nuclear Waste Management XX: Volume 465
Author: Walter J. Gray
Publisher:
Total Pages: 1398
Release: 1997-07
Genre: Technology & Engineering
ISBN:

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This book features scientific research that supports the safe and effective disposal of radioactive waste in a geological repository. One highlight of the volume is the opening talk by Rustum Roy, who was instrumental in establishing the first symposium on this topic in 1978. Professor Roy summarizes his views of the past 19 years of progress in the field. A second highlight is the participation by several Russian and Ukrainian scientists who authored papers on nuclear waste disposal aspects of the Chernobyl Unit 4 reactor that exploded in April 1986. Additional topics include: glass formulations and properties; glass/water interactions; cements in radioactive waste management; ceramic and crystalline waste forms; spent nuclear fuel; waste processing and treatment; radiation effects in ceramics, glasses and nuclear waste materials; waste package materials; radionuclide solubility and speciation; radionuclide sorption; radionuclide transport; repository backfill; performance assessment; natural analogues and excess plutonium dispositioning.