Ispsd 94
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Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Author | : U. Gösele |
Publisher | : The Electrochemical Society |
Total Pages | : 636 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : 9781566771894 |
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Discrete and Integrated Power Semiconductor Devices
Author | : Vítezslav Benda |
Publisher | : John Wiley & Sons |
Total Pages | : 438 |
Release | : 1999-01-26 |
Genre | : Technology & Engineering |
ISBN | : 9780471976448 |
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Dieses Buch beschreibt in leicht verständlicher Weise Aufbau, Funktion, Eigenschaften und Anwendungsmöglichkeiten wichtiger Halbleiter-Bauelemente - von Leistungsdioden über Thyristoren und MOSFETs bis hin zu integrierten Systemen. Die Autoren verzichten dabei auf komplizierte Mathematik; sie stützen sich vielmehr auf grundlegende physikalische Modelle. (11/98)
Investigation of Reliability Aspects of Power Semiconductors in Photovoltaic Central Inverters for Sunbelt Regions
Author | : Christian Felgemacher |
Publisher | : kassel university press GmbH |
Total Pages | : 186 |
Release | : 2018-03-23 |
Genre | : |
ISBN | : 3737604940 |
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High reliability and system lifetimes in the range of 30 years are essential for renewable energy systems such as photovoltaic power plants to minimise costs for the generated electric energy. At the same time such systems are used in regions with high solar irradiance and also harsh environmental conditions. Therefore, designs for photovoltaic inverters need to meet not only the key design criteria of high conversion efficiency but also need to be very robust and at the same time meet challenging cost targets. In this dissertation aspects concerning the lifetime and reliability of power semiconductors in photovoltaic central inverters are investigated. On key topic of the dissertation is the measurement of the voltage dependent failure rate due to cosmic radiation induced single-event-burnout of SiC and Si power semiconductors. The second topic is the development of a system level simulation to quantify the stress on the power semiconductors in a PV central inverters in various regions of the world. Further topics are the investigation of improved control concepts for the cooling system of PV central inverters and the monitoring of IGBT temperatures during converter operation.
Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs
Author | : |
Publisher | : |
Total Pages | : 512 |
Release | : 2004 |
Genre | : Integrated circuits |
ISBN | : |
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Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment
Author | : Denis Flandre |
Publisher | : Springer Science & Business Media |
Total Pages | : 364 |
Release | : 2005-02-15 |
Genre | : Science |
ISBN | : 9781402030123 |
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This book collects the papers presented during NATO Advanced Research Workshop "Science and technology of Semiconductor on Insulator (SOI) structures and devices operating in a harsh environment" held in Kiev 26-30 April 2004. The volume contains both reviews from invited speakers and selected papers presenting major innovations in SOI materials and devices. Particular attention is paid to the reliability of SOI structures operated under harsh conditions. In the first part of the book dealing with SOI material technology, the evolution of SOI materials, achievements in the main standard technologies as Smart Cut, SIMOX, porous silicon as well as methods to create more exotic structures are described. The second part of the book covers the reliability aspect of SOI devices operating in a harsh environment: high and low temperatures, high voltages, with a focus on radiation effects and characterization of these devices. Third part of the book overviews novel devices and sensors opportunities for such conditions and the closes with papers discussing the perspectives of SOI scaling to nano devices.
Smart Power ICs
Author | : Bruno Murari |
Publisher | : Springer Science & Business Media |
Total Pages | : 598 |
Release | : 2002-06-13 |
Genre | : Design |
ISBN | : 9783540432388 |
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This book provides a survey of the state of the art of technology and future trends in the new family of Smart Power ICs and describes design and applications in a variety of fields ranging from automotive to telecommunications, reliability evaluation and qualification procedures. The book is a valuable source of information and reference for both power IC design specialists and to all those concerned with applications, the development of digital circuits and with system architecture.