Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Author: Erdogan Madenci
Publisher: Springer Science & Business Media
Total Pages: 201
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461502551

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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Author: Erdogan Madenci
Publisher: Springer
Total Pages: 185
Release: 2002-12-31
Genre: Technology & Engineering
ISBN: 9781402073304

Download Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® Book in PDF, Epub and Kindle

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author: E-H Wong
Publisher: Woodhead Publishing
Total Pages: 477
Release: 2015-05-23
Genre: Technology & Engineering
ISBN: 0857099116

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2
Author: Willem Dirk van Driel
Publisher: Springer
Total Pages: 603
Release: 2017-07-11
Genre: Technology & Engineering
ISBN: 3319581759

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In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability
Author: Dongkai Shangguan
Publisher: ASM International
Total Pages: 292
Release: 2005
Genre: Technology & Engineering
ISBN: 161503093X

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Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints
Author: John H. Lau
Publisher: Springer Nature
Total Pages: 545
Release: 2020-05-29
Genre: Technology & Engineering
ISBN: 9811539200

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments
Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
Total Pages: 202
Release: 2008-12-16
Genre: Technology & Engineering
ISBN: 0387793941

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Reliability of High-Power Mechatronic Systems 1

Reliability of High-Power Mechatronic Systems 1
Author: Abdelkhalak El Hami
Publisher: Elsevier
Total Pages: 314
Release: 2017-09-27
Genre: Technology & Engineering
ISBN: 0081024223

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This first volume of a set dedicated to the reliability of high-power mechatronic systems focuses specifically on simulation, modeling and optimization in automotive and aerospace applications. In the search to improve industrial competitiveness, the development of methods and tools for the design of products is especially pertinent in the context of cost reduction. This book seeks to propose new methods that simultaneously allow for a quicker design of future mechatronic devices in the automotive and aerospace industries while guaranteeing their increased reliability. The reliability of these critical elements is further validated digitally through new multi-physical and probabilistic models that could ultimately lead to new design standards and reliable forecasting. Presents a methodological guide that demonstrates the reliability of fractured mechatronic components and devices Includes numerical and statistical models to optimize the reliability of the product architecture Helps users develop a methodology to characterize critical elements at the earliest stage

Safety, Reliability, Risk and Life-Cycle Performance of Structures and Infrastructures

Safety, Reliability, Risk and Life-Cycle Performance of Structures and Infrastructures
Author: George Deodatis
Publisher: CRC Press
Total Pages: 1112
Release: 2014-02-10
Genre: Technology & Engineering
ISBN: 1315884887

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Safety, Reliability, Risk and Life-Cycle Performance of Structures and Infrastructures contains the plenary lectures and papers presented at the 11th International Conference on STRUCTURAL SAFETY AND RELIABILITY (ICOSSAR2013, New York, NY, USA, 16-20 June 2013), and covers major aspects of safety, reliability, risk and life-cycle performance of str

ANSYS Workbench Tutorial Release 14

ANSYS Workbench Tutorial Release 14
Author: Kent L. Lawrence
Publisher: SDC Publications
Total Pages: 304
Release: 2012
Genre: Computers
ISBN: 1585037540

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The exercises in ANSYS Workbench Tutorial Release 14 introduce you to effective engineering problem solving through the use of this powerful modeling, simulation and optimization software suite. Topics that are covered include solid modeling, stress analysis, conduction/convection heat transfer, thermal stress, vibration, elastic buckling and geometric/material nonlinearities. It is designed for practicing and student engineers alike and is suitable for use with an organized course of instruction or for self-study. The compact presentation includes just over 100 end-of-chapter problems covering all aspects of the tutorials.