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| Author | : Myoung Joon Choi |
| Publisher | : |
| Total Pages | : 234 |
| Release | : 2004 |
| Genre | : |
| ISBN | : |
| Author | : Balsha R. Stanisic |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 221 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461313996 |
In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
| Author | : Varvara Kollia |
| Publisher | : |
| Total Pages | : 320 |
| Release | : 2008 |
| Genre | : |
| ISBN | : 9780549909521 |
We have developed a modular extended segmentation procedure for the electromagnetic modeling of the power distribution network in packaged integrated circuits. The fundamental blocks that build the power distribution network are identified and modeled individually. An integral equation approach is employed for the electromagnetic simulation of the field on the boundary of the parallel-plate metallization pairs and circuit models, and finite methods are used for the local discontinuities. In particular, finite differences in the frequency domain are employed to model splits in metallization planes, vias and pins. Circuit models are used to capture the field behavior at the boundaries and at plane bifurcations. The technique includes the incorporation of lumped elements. The network multiport is formed in a hierarchical systematic manner. Furthermore, a special methodology for the incorporation of the various loss mechanisms present in real structures is introduced. Finally, a rational function interpolation technique is incorporated in the extended segmentation framework. The main attributes of the proposed methodology are its modularity and its computational efficiency. As the field is described in terms of an equivalent electromagnetic problem on the boundary of the domain, the number of unknowns increases linearly with the periphery length. Another significant contribution of the method is that it allows for the a priori modeling of the discontinuities. This leads to enhanced computational efficiency, as one model per discontinuity type would suffice to model a large number of identical discontinuities. Also, due to the fact that the system is described in terms of generic multiports in the subsystem level, the method helps with the electrical performance assessment during the design phase. The accuracy and the effectiveness of the proposed methodology are demonstrated through several validation studies and through its application to realistic board designs.
| Author | : Rohit Sharma |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 81 |
| Release | : 2012-02-17 |
| Genre | : Technology & Engineering |
| ISBN | : 1461410703 |
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
| Author | : Taehyoun Oh |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2013-09-07 |
| Genre | : Technology & Engineering |
| ISBN | : 9781461449621 |
This book describes design techniques that can be used to mitigate crosstalk in high-speed I/O circuits. The focus of the book is in developing compact and low power integrated circuits for crosstalk cancellation, inter-symbol interference (ISI) mitigation and improved bit error rates (BER) at higher speeds. This book is one of the first to discuss in detail the problem of crosstalk and ISI mitigation encountered as data rates have continued beyond 10Gb/s. Readers will learn to avoid the data performance cliff, with circuits and design techniques described for novel, low power crosstalk cancellation methods that are easily combined with current ISI mitigation architectures.
| Author | : Albert Ruehli |
| Publisher | : John Wiley & Sons |
| Total Pages | : 609 |
| Release | : 2017-05-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1119078407 |
Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.
| Author | : Eduard Säckinger |
| Publisher | : John Wiley & Sons |
| Total Pages | : 470 |
| Release | : 2005-03-11 |
| Genre | : Technology & Engineering |
| ISBN | : 0471712337 |
An expert guide to the new and emerging field of broadband circuits for optical fiber communication This exciting publication makes it easy for readers to enter into and deepen their knowledge of the new and emerging field of broadband circuits for optical fiber communication. The author's selection and organization of material have been developed, tested, and refined from his many industry courses and seminars. Five types of broadband circuits are discussed in detail: * Transimpedance amplifiers * Limiting amplifiers * Automatic gain control (AGC) amplifiers * Lasers drivers * Modulator drivers Essential background on optical fiber, photodetectors, lasers, modulators, and receiver theory is presented to help readers understand the system environment in which these broadband circuits operate. For each circuit type, the main specifications and their impact on system performance are explained and illustrated with numerical values. Next, the circuit concepts are discussed and illustrated with practical implementations. A broad range of circuits in MESFET, HFET, BJT, HBT, BiCMOS, and CMOS technologies is covered. Emphasis is on circuits for digital, continuous-mode transmission in the 2.5 to 40 Gb/s range, typically used in SONET, SDH, and Gigabit Ethernet applications. Burst-mode circuits for passive optical networks (PON) and analog circuits for hybrid fiber-coax (HFC) cable-TV applications also are discussed. Learning aids are provided throughout the text to help readers grasp and apply difficult concepts and techniques, including: * Chapter summaries that highlight the key points * Problem-and-answer sections to help readers apply their new knowledge * Research directions that point to exciting new technological breakthroughs on the horizon * Product examples that show the performance of actual broadband circuits * Appendices that cover eye diagrams, differential circuits, S parameters, transistors, and technologies * A bibliography that leads readers to more complete and in-depth treatment of specialized topics This is a superior learning tool for upper-level undergraduates and graduate-level students in circuit design and optical fiber communication. Unlike other texts that concentrate on analog circuits in general or mostly on optics, this text provides balanced coverage of electronic, optic, and system issues. Professionals in the fiber optic industry will find it an excellent reference, incorporating the latest technology and discoveries in the industry.
| Author | : Stephen C. Thierauf |
| Publisher | : Artech House |
| Total Pages | : 321 |
| Release | : 2017-04-30 |
| Genre | : Technology & Engineering |
| ISBN | : 163081444X |
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
| Author | : Stephen C. Thierauf |
| Publisher | : Artech House |
| Total Pages | : 259 |
| Release | : 2004 |
| Genre | : Technology & Engineering |
| ISBN | : 1580531318 |
As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.
