Advanced Cooling Technologies and Applications

Advanced Cooling Technologies and Applications
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
Total Pages: 154
Release: 2019-01-30
Genre: Science
ISBN: 1789848385

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Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Author: Madhusudan Iyengar
Publisher: World Scientific
Total Pages: 479
Release: 2024-01-10
Genre: Technology & Engineering
ISBN: 9811279381

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This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Thermal Management for Opto-electronics Packaging and Applications

Thermal Management for Opto-electronics Packaging and Applications
Author: Xiaobing Luo
Publisher: John Wiley & Sons
Total Pages: 373
Release: 2024-05-29
Genre: Technology & Engineering
ISBN: 1119179297

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A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Air Cooling Technology for Electronic Equipment

Air Cooling Technology for Electronic Equipment
Author: Sung Jin Kim
Publisher: CRC Press
Total Pages: 264
Release: 2020-07-24
Genre: Technology & Engineering
ISBN: 1000151743

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Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
Total Pages: 633
Release: 2011-01-05
Genre: Technology & Engineering
ISBN: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Making Appropriations for the Department of Defense for the Fiscal Year Ending September 30, 2006, and for Other Purposes

Making Appropriations for the Department of Defense for the Fiscal Year Ending September 30, 2006, and for Other Purposes
Author: United States. Congress
Publisher:
Total Pages: 540
Release: 2005
Genre: Business & Economics
ISBN:

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House Report 109-359. To Accompany the bill H.R. 2863, which was not yet enacted into law when this conference report was ordered to be printed on December 18, 2005. This conference report is part of the legislative history of the proposed Department of Defense Appropriations Act, 2006.

Electronics Cooling

Electronics Cooling
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
Total Pages: 184
Release: 2016-06-15
Genre: Computers
ISBN: 9535124056

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Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Hybrid Technologies for Medium to Heavy-duty Commercial Trucks

Hybrid Technologies for Medium to Heavy-duty Commercial Trucks
Author: United States. Congress. House. Committee on Science and Technology (2007). Subcommittee on Energy and Environment
Publisher:
Total Pages: 68
Release: 2008
Genre: Technology & Engineering
ISBN:

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Emerging Two-Phase Cooling Technologies for Power Electronic Inverters

Emerging Two-Phase Cooling Technologies for Power Electronic Inverters
Author: J. S. Hsu
Publisher:
Total Pages:
Release: 2005
Genre:
ISBN:

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In order to meet the Department of Energy's (DOE's) FreedomCAR and Vehicle Technologies (FVCT) goals for volume, weight, efficiency, reliability, and cost, the cooling of the power electronic devices, traction motors, and generators is critical. Currently the power electronic devices, traction motors, and generators in a hybrid electric vehicle (HEV) are primarily cooled by water-ethylene glycol (WEG) mixture. The cooling fluid operates as a single-phase coolant as the liquid phase of the WEG does not change to its vapor phase during the cooling process. In these single-phase systems, two cooling loops of WEG produce a low temperature (around 70 C) cooling loop for the power electronics and motor/generator, and higher temperature loop (around 105 C) for the internal combustion engine. There is another coolant option currently available in automobiles. It is possible to use the transmission oil as a coolant. The oil temperature exists at approximately 85 C which can be utilized to cool the power electronic and electrical devices. Because heat flux is proportional to the temperature difference between the device's hot surface and the coolant, a device that can tolerate higher temperatures enables the device to be smaller while dissipating the same amount of heat. Presently, new silicon carbide (SiC) devices and high temperature direct current (dc)-link capacitors, such as Teflon capacitors, are available but at significantly higher costs. Higher junction temperature (175 C) silicon (Si) dies are gradually emerging in the market, which will eventually help to lower hardware costs for cooling. The development of high-temperature devices is not the only way to reduce device size. Two-phase cooling that utilizes the vaporization of the liquid to dissipate heat is expected to be a very effective cooling method. Among two-phase cooling methods, different technologies such as spray, jet impingement, pool boiling and submersion, etc. are being developed. The Oak Ridge National Laboratory (ORNL) is leading the research on a novel floating refrigerant loop that cools high-power electronic devices and the motor/generator with very low cooling energy. The loop can be operated independently or attached to the air conditioning system of the vehicle to share the condenser and other mutually needed components. The ability to achieve low cooling energy in the floating loop is attributable to the liquid refrigerant operating at its hot saturated temperature (around 50 C+). In an air conditioning system, the liquid refrigerant is sub-cooled for producing cool air to the passenger compartment. The ORNL floating loop avoids the sub-cooling of the liquid refrigerant and saves significant cooling energy. It can raise the coefficient of performance (COP) more than 10 fold from that of the existing air-conditioning system, where the COP is the ratio of the cooled power and the input power for dissipating the cooled power. In order to thoroughly investigate emerging two-phase cooling technologies, ORNL subcontracted three university/companies to look into three leading two-phase cooling technologies. ORNL's assessments on these technologies are summarized in Section I. Detailed descriptions of the reports by the three university/companies (subcontractors) are in Section II.