Thermal Conductivity 20

Thermal Conductivity 20
Author: J.R., Jr. Thomas
Publisher: Springer
Total Pages: 440
Release: 2011-09-26
Genre: Technology & Engineering
ISBN: 9781461280699

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The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.

Thermal Conductivity 20

Thermal Conductivity 20
Author: D. P. H. Hasselman
Publisher: Plenum Publishing Corporation
Total Pages: 439
Release: 1989
Genre: Science
ISBN: 9780306430978

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Proceedings of the 20th International Thermal Conductivity Conference held in Blacksburg, Va. Oct. 1987. Over 40 papers present current reviews of international research. General topics discussed include insulation, metallic materials, high temperature materials, fluids, other materials and effects, methods, and composites. Annotation copyright Boo

Thermal Conductivity 20

Thermal Conductivity 20
Author: J.R., Jr. Thomas
Publisher: Springer Science & Business Media
Total Pages: 422
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461307619

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The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.

Thermal Conductivity

Thermal Conductivity
Author: Daniel R. Flynn
Publisher:
Total Pages: 832
Release: 1968
Genre: Heat
ISBN:

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Contains the text or abstracts of ninety papers contributed to the conference.