Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Author: M O Alam
Publisher: Elsevier
Total Pages: 279
Release: 2011-05-25
Genre: Technology & Engineering
ISBN: 0857092898

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
Author: James J. Licari
Publisher: William Andrew
Total Pages: 415
Release: 2011-06-24
Genre: Technology & Engineering
ISBN: 1437778909

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Approx.512 pages Approx.512 pages

Electrically Conductive Adhesives

Electrically Conductive Adhesives
Author: Rajesh Gomatam
Publisher: CRC Press
Total Pages: 436
Release: 2008-12-23
Genre: Science
ISBN: 9004187820

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With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni

Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
Total Pages: 445
Release: 2009-10-08
Genre: Technology & Engineering
ISBN: 0387887830

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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Adhesives, Sealants and Coatings for the Electronics Industry

Adhesives, Sealants and Coatings for the Electronics Industry
Author: Ernest W. Flick
Publisher: William Andrew
Total Pages: 1038
Release: 1992-12-31
Genre: Science
ISBN:

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The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

Adhesion in Microelectronics

Adhesion in Microelectronics
Author: K. L. Mittal
Publisher: John Wiley & Sons
Total Pages: 293
Release: 2014-08-25
Genre: Technology & Engineering
ISBN: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Applied Adhesive Bonding in Science and Technology

Applied Adhesive Bonding in Science and Technology
Author: Halil Ozer
Publisher: BoD – Books on Demand
Total Pages: 146
Release: 2018-02-21
Genre: Technology & Engineering
ISBN: 9535138391

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This book brings together scientists and provides the reader with a comprehensive overview of some recent developments in the field of adhesive bonding with the contributions of internationally recognized authors. This book is divided into three sections: "Structural Adhesive Bonding," "Wood Adhesive Bonding," and "Adhesive Bonding in Medical Applications." Each section presents an important review and some applications of the adhesive bonding in various different disciplines. I hope that the book published in open access will help researchers to benefit from it.

Adhesion and Adhesives

Adhesion and Adhesives
Author: A. J. Kinloch
Publisher: Springer Science & Business Media
Total Pages: 474
Release: 1987-08-31
Genre: Technology & Engineering
ISBN: 9780412274404

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Discussing the subject from first principles, this text explores aspects of surface chemistry and physics, and goes on to consider the chemistry of adhesives, the engineering design of joints and the problem of attaining an adequate service life from bonded joints.

Industrial Applications of Adhesives

Industrial Applications of Adhesives
Author: Lucas F. M. da Silva
Publisher: Springer Nature
Total Pages: 144
Release: 2020-07-22
Genre: Science
ISBN: 9811567670

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This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.