Download 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Book in PDF, Epub and Kindle
Technical scope of the conference covers power semiconductor devices and power integrated circuits, including but not limited to device physics, modeling, design, fabrication, materials, packaging and integration, device reliability, and device circuit interactions It will include 6 different technical tracks, namely, High Voltage Power Devices (HV), Low Voltage Devices and Power IC Device Technology (LVT), Power IC Design (ICD), GaN and Nitride Base Compound Materials (GaN), SiC and Other Materials (SiC), Module and Package Technologies (PK)